According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.Overview and certain other are put into protective to allow easy handling and assembly onto and to protect the devices from damage. A very large numb. • : Metal electrode leadless face (usually for resistors and diodes)• SOD: Small-outline diode• SOT: (also SOT-23, SOT-223, SOT-323).