Selection 1: Packaging method and process: Hermetic packaging (TO-CAN, BOX, butterfly), non-hermetic packaging (COB, COC, etc. PLC splitter package process includes coupling alignment and bonding operations. Coupling of the PLC splitter chip and the optical fiber array is aligned with both manual and automated, and they depend on the hardware with the six-dimensional precision trimming frame, the light source, power meter. The embodiment of the invention discloses an optical splitter and a packaging method thereof, wherein the optical splitter comprises a packaging shell, an optical splitting unit, at least one input optical fiber, a plurality of output optical fibers, at least one input optical fiber protective. A Passive Optical Network (PON) is a fiber optic technology utilizing point-to-multipoint topology and optical splitters to deliver data from a single transmission point to multiple user endpoints. Passive refers to the unpowered condition of the fiber and splitting/combining components. Both fiber. PLC Chip: Manufactured using semiconductor technology processes (such as photolithography, etching, etc. Optical Fiber Array: Using a V-groove substrate, a bundle of optical fibers or a ribbon of optical fibers are installed on the substrate at. Optical splitters can be classified into two types based on the splitting principle: fused biconical taper (FBT Coupler Splitters) and planar lightwave circuit (PLC Splitters).