Aluminum nitride (AlN) is one of the most thermally conductive ceramic materials. In optical communication modules, the trend toward greater miniaturization and integration is making aluminum nitride essential as a submount material for laser diodes (LDs), which generate high levels of heat. The ceramic substrate material is Aluminium Nitride (AlN). Standard grade is 170W/m·K. Via the acquisition of Ion Beam Milling, Inc. As each application is different, we work with. R emtec manufactures High performance metallized laser and photo diode submounts, accessory circuits and spacers to customer specification. Remtec's submounts are produced on BeO and AIN ceramics using PCTF® (Plated Copper on Thick Film) metallization. For less thermally demanding applications. As the submount for the heat dissipation of high-power diode laser chips, the AuSn pre-deposited DPC material is fabricated through metallization of AlN ceramic substrate and pre-deposition of micron-level AuSn thin film in specific areas. It is a key technology that ensures the long-term reliable.
