Optical module substrates serve as the foundational platform for mounting and interconnecting optical chips, electronic ICs, and photonic components in high-speed optical modules. • SHINKO is developing Co-Packaged Optics (CPO) technologies for high-speed, high-bandwidth data transmission with low power consumption. *4 DLL : Direct Laser & Lamination / DLL is registered trademarks of SHINKO ELECTRIC. Integrated circuits and reference designs help you create a smaller and faster optical module design used in high-bandwidth data communication applications. Whether you are creating a 100-Gbps or 400-Gbps, small form-factor pluggable (SFP) module, SFP+ transceiver, XFP module, CFP, X2/XENPAK module. The Printed Circuit Board (PCB) at the heart of these modules is no longer a simple substrate but a highly engineered system. Although InP substrates have been the gold standard for such applications, the high cost and limited. Definition: An Optical Module PCB is the internal circuit board of a transceiver (like SFP, QSFP, or OSFP) responsible for converting electrical signals to optical signals and vice versa.